发明名称 |
Side-bonding method of flip-chip semiconductor device, MEMS device package and package method using the same |
摘要 |
A side-bonding method of a flip-chip semiconductor device, a MEMS device package and a package method using the same, in which firm bonding and insensitivity to surface roughness may be obtained, include forming a UBM on a bonding line of a lower substrate having a semiconductor device formed thereon, plating solder on the UBM on the lower substrate, forming a trench in the upper substrate to contact the lower substrate at a location corresponding to a location of the solder and forming a second UBM in the trench, coupling the upper substrate and the lower substrate by inserting the solder into the trench, and heating the upper substrate and the lower substrate at a temperature higher than a melting point of the solder so that the solder is wetted toward sides of the trench to bond the upper substrate and the lower substrate.
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申请公布号 |
US2004106294(A1) |
申请公布日期 |
2004.06.03 |
申请号 |
US20030703587 |
申请日期 |
2003.11.10 |
申请人 |
LEE EUN SUNG;KOH BYEONG-CHEON;MOON CHANG-YOUL;CHUN KUKJIN |
发明人 |
LEE EUN SUNG;KOH BYEONG-CHEON;MOON CHANG-YOUL;CHUN KUKJIN |
分类号 |
B81C1/00;B23K1/20;B23K101/40;B81B7/00;H01L21/60;H01L23/02;(IPC1-7):H01L21/302;H01L21/461 |
主分类号 |
B81C1/00 |
代理机构 |
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代理人 |
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主权项 |
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