| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming wiring of a display device in which an upper layer of metal wiring is completely covered with a wiring protective film in the case the metal wiring is formed with a lift-off method. SOLUTION: After photoresist formation (S101), the metal wiring is formed (S102) with the lift-off method. Subsequently suitable heating, ashing, etching or additional developing are carried out. Thereby the photoresist withdraws from a metal wiring edge part (S103), and when the wiring protective film is laminated with sputtering (S104) an aperture angle of an upper face of the metal wiring against showering sputter particles is widened. As the sputter particles deposit corresponding to the aperture angle, upper and side faces of the metal wiring are completely covered with the wiring protective film. COPYRIGHT: (C)2004,JPO |
