| 摘要 |
PROBLEM TO BE SOLVED: To prevent voids from being produced in an underfill which is used when a silicon chip is bonded on a board through the intermediary of bumps. SOLUTION: A method of manufacturing the flip chip device comprises steps of: applying adhesive organic resin containing a volatile component having a content of 0.5 wt% or below at a temperature of 200°C on a board under a reduced pressure when the silicon chip is mounted on the board equipped with bumps, or the silicon chip equipped with the bonding bumps is mounted on the board through adhesive organic resin; bonding the silicon chip on the board with adhesive organic resin while the silicon chip is pressed and heated; curing the organic resin completely under a normal pressure through a reflow oven; and fusing the bumps so as to bond the silicon chip on the board. Voids are hardly contained in the hardened body of the adhesive organic resin used for bonding the chip on the board or between the board and the chip, such as in an interface between the hardened body and the board or the like, so that the device is much improved in reliability. COPYRIGHT: (C)2004,JPO
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