发明名称 |
Semiconductor device and method of fabricating the same |
摘要 |
There is disclosed a method of fabricating TFTs having reduced interconnect resistance by having improved contacts to source/drain regions. A silicide layer is formed in intimate contact with the source/drain regions. The remaining metallization layer is selectively etched to form a contact pad or conductive interconnects.
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申请公布号 |
US2004104435(A1) |
申请公布日期 |
2004.06.03 |
申请号 |
US20030703632 |
申请日期 |
2003.11.10 |
申请人 |
SEMICONDUCTOR ENERGY LABORATORY CO., LTD., A JAPAN CORPORATION |
发明人 |
OHTANI HISASHI;FUJIMOTO ETSUKO |
分类号 |
H01L29/78;H01L21/336;H01L21/77;H01L21/84;H01L27/12;H01L29/45;H01L29/786;(IPC1-7):H01L21/00 |
主分类号 |
H01L29/78 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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