| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a film formation method which enables reduction of the manufacturing cost and time in film formation, by applying a liquid material to the entire desired pattern region and to provide an optical element, a semiconductor element, and electronic equipment. <P>SOLUTION: In the film formation method, a patterning region is divided by forming a partition 11 in a treatment surface of a substrate 10, and a desired film is provided to the patterning region, having a process for filling an inner region of the partition 11 with the liquid material. In the method, a film 12 formed of desired solvent is formed in the inner region of the partition 11, prior to the process for filling it with the liquid material. <P>COPYRIGHT: (C)2004,JPO</p> |
