| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To ensure high reliability for a long period of time by reducing deformation and warpage of a module structure which is comprised of a ceramics circuit board and a metal heat sink. <P>SOLUTION: A module member has an arrangement wherein the ceramics circuit board is jointed to the metal heat sink through a metal plate (A) mainly made of aluminum. In the member, (1) the thickness of the metal plate (A) should be 400μm or more and 1200μm or below; (2) the metal heat sink should consists of an aluminum alloy whose Vickers hardness after heating for four minutes at a temperature of 630°C is 30 HV or more; and (3) exothermic electrical parts each mounted at a desired position on circuit forming metal plates (B) should be sequentially provided on the ceramics circuit board, a notch should be formed in the metal plate (B) and/or metal heat sink, and the notch should be provided outside a conical-trapezoid region which is defined by a group of straight lines oriented downward from an edge of the exothermic electrical part that contacts the metal plate (B), at an angle of 45°with respect to the vertical direction. <P>COPYRIGHT: (C)2004,JPO</p> |
