| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of improving in-plane evenness for instance, in removing organic substances on a substrate. SOLUTION: Before a removing liquid is applied from a removing liquid nozzle 7 to a substrate W, a temperature-controlled pure water is applied from a rear-surface liquid nozzle 11 to the rear surface of the substrate W. The difference in temperature is defined to be within 20°C between the removing liquid from the removing liquid nozzle 7 and the pure water from the rear-surface liquid nozzle 11. By supplying the temperature-controlled pure water to the rear side of the substrate W to bring the temperature of the substrate W close to the temperature of the removing liquid, the temperature of the removing liquid flowing on the surface of the substrate W becomes almost iniform on the whole surface of the substrate W, and even when the removing liquid is large in temperature dependency, the in-plane evenness of the substrate in removing organic substances such as polymer can be improved. COPYRIGHT: (C)2004,JPO
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