| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having excellent photosensitivity, and further having excellent flexibility, adhesion, pencil hardness, solvent resistance, acid resistance, heat resistance, resistance to gold plating or the like; and to provide a cured product comprising the resin composition. <P>SOLUTION: The photosensitive resin composition comprises (A) an alkali aqueous solution-soluble resin, (B) a crosslinking agent, (C) a photopolymerization initiator and (D) an epoxy resin represented by the formula (1) (wherein, n is an average value and 1.01-5). <P>COPYRIGHT: (C)2004,JPO |
