Substrate bonding device for making liquid crystal display panel, comprises chamber moving mechanism for raising and lowering upper chamber unit, seal, and upper and lower stages for securing first and second substrates, respectively

摘要

A substrate bonding device for fabricating liquid crystal display panel, comprises a lower chamber unit on base frame with upper surface; an upper chamber unit with lower surface; chamber moving mechanism for raising and lowering upper chamber unit; an upper stage for securing first substrate; a lower stage for securing second substrate; and a seal for sealing interior space around substrates. A substrate bonding device for fabricating a liquid crystal display (LCD) panel, comprises a base frame (100); a lower chamber unit (220) mounted to the base frame, having an upper surface; an upper chamber unit (210) arranged over the lower chamber unit, which is moveable relative to the base, and has a lower surface; chamber moving mechanism mounted to the base frame for raising and lowering the upper chamber unit; an upper stage (230) fixed to the upper chamber unit (212) for securing a first substrate; a lower stage (240) fixed to the lower chamber unit (222) for securing a second substrate; and a sealing mechanism provided to the upper and/or lower surfaces for sealing an interior space surrounding the first and second substrates. The sealed interior space is definable by joined upper and lower chamber units. An independent claim is included for a method for fabricating a liquid crystal display (LCD) panel using a substrate bonding device as above, comprising loading the first and second substrates onto the upper and lower stages, respectively; lowering the upper chamber unit to seal the interior space from an external environment via the sealing mechanism; evacuating the sealed interior space; raising the upper chamber unit and the upper stage to align the first and second substrates; contacting the first and second substrates with a sealant material; venting the sealed interior space to apply pressure to the first and second substrates contacted by the sealant material, where, after venting, the first and substrates are bonded together; and unloading the bonded substrates.