| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for sealing, excellent in laser marking property and electric characteristics, causing no short circuit due to electroconductive materials even in an electronic part device with a narrow interval between pads or wires and having excellent moldability, reliability and package surface externals, and to provide electronic part devices using the epoxy resin composition. <P>SOLUTION: The epoxy resin composition for sealing comprises an epoxy resin, a curing agent, non-electroconductive carbon and an inorganic filler as essential ingredients, wherein the epoxy resin includes one or more epoxy resins of a biphenyl type represented by formula (I), a bisphenol F type represented by formula (II), a sulfur-containing type represented by formula (III) or a novolak type represented by formula (IV). In each formula, R<SP>1</SP>to R<SP>16</SP>and R are selected from H and 1-10C (substituted) hydrocarbons and may be same or different each other and (n) is an integer of 0-3 in formulas (I) and (II) and an integer of 1-10 in formulas (III) and (IV). <P>COPYRIGHT: (C)2004,JPO |
