| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for holding a substrate to the placing surface for substantially perfectly cutting off the substrate, for separating the substrate along the cutting pattern into dies, and for holding the cut dies to the placing surface during and after the cutting process. <P>SOLUTION: In a process and system for cutting off a wafer 14 including a semiconductor substrate provided with an array of integrated elements, the apparatus has a porous placing surface and includes a vacuum chuck for holding the wafer by vacuum. The wafer 14 is cut off by irradiating the substrate by pulsed laser of an ultraviolet laser using a solid state laser 10 having controlled polarization. The separated dies are adhered with adhesive film to be removed from the placing surface. Alternatively, the separated dies are removed from the wafer 14 by another way after being cut. <P>COPYRIGHT: (C)2004,JPO |
