发明名称 MULTILAYER PRINTED WIRING BOARD AND METHOD OF MANUFACTURING LEAD WIRE GUIDE SECTION THEREIN
摘要 PROBLEM TO BE SOLVED: To surely lay and wire a lead wire, to reduce the number of components, and to simplify the configuration and the manufacturing. SOLUTION: A multilayer printed wiring board 14 is formed by stacking a plurality of patterned resin films 14a. A lead wire guide section 17 is integrally formed with the multilayer printed wiring board 14. The lead wire guide section 17 is formed in the shape of a rib which projects in the protruding direction of the resin films 17. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004158791(A) 申请公布日期 2004.06.03
申请号 JP20020325372 申请日期 2002.11.08
申请人 DENSO CORP 发明人 NAKAMURA KENJI
分类号 H05K7/00;H05K1/02;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K7/00
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