| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer board in which the accuracy of a through hole can be enhanced, a manufacturing time can be shortened by simplifying production, and adhesion can be enhanced between layers. SOLUTION: The multilayer board is manufactured through seven steps as follows. 1. Metal foil having a three-layer structure of copper 2/nickel 3/copper 4 is formed on the surface of a resin substrate 1, and an etching resist 5 is formed in a region other than bumps. 2. Etching is performed. 3. Bumps are subjected to solder plating after removing the resist. 4. Copper foil 4 laid under a solder plating layer is etched. 5. An adhesive resin film 7 is formed on the rear surface of the resin substrate. 6. Holes fitted with lower layer bumps are formed in the adhesive resin and the resin substrate by laser beam machining. 7. The layers are integrated by full hot press. COPYRIGHT: (C)2004,JPO |
