发明名称 |
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE HAVING MULTILEVEL INTERCONNECTION |
摘要 |
One via contact through which upper and lower interconnections of a multilevel interconnection are connected to each other is provided when the width or volume of the lower interconnection is not larger than a given value. A plurality of via contacts are arranged at regular intervals, each of which is not larger than a given value, in an effective diffusion region of voids included in the lower interconnection, when the width or volume of the lower interconnection exceeds a given value.
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申请公布号 |
US2004104482(A1) |
申请公布日期 |
2004.06.03 |
申请号 |
US20030717556 |
申请日期 |
2003.11.21 |
申请人 |
MIYAMOTO KOJI;YOSHIDA KENJI;KANEKO HISASHI |
发明人 |
MIYAMOTO KOJI;YOSHIDA KENJI;KANEKO HISASHI |
分类号 |
H01L21/768;H01L21/3205;H01L21/82;H01L21/822;H01L23/52;H01L23/522;H01L23/532;H01L27/04;(IPC1-7):H01L33/00 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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