| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem associated with the performance of a read/write amplifier IC fastened to an FCA mounted on a hard disk drive that has a large impact on the property of the hard disk drive itself, since the bad performance is stemmed from the read/write speed deterioration of the read/write amplifier IC due to the fact that the bad heat dissipation of the IC has risen its temperature. SOLUTION: An electrode 15 for heat dissipation is exposed from the backside of insulating resin 13, and a metal plate 23 is fastened to the electrode 15 for heat dissipation. The backside of the metal plate 23 and the backside of a flexible sheet are arranged substancially on the same plane, and can be easily fastened to a second support member 24. Therefore, heat generated from a semiconductor device can be dissipated well through the electrode 15 for heat dissipation, the metal plate 23 and the second support member 24. COPYRIGHT: (C)2004,JPO |
