| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a similar flip chip type light emitting diode device package. <P>SOLUTION: The similar flip chip type light emitting diode device package comprises a transparent substrate 200 having a first surface with a recess 202, and a light emitting diode 204 placed in the recess 202. The light emitting diode 204 emits light toward the transparent substrate 200 as in a flip chip die, so that the emission cannot be obstructed by a bonding pad 205 at the upper portion of the light emitting diode 204, thus increasing an emission area and increasing emission intensity. Further, since the light emitting diode 204 is placed in the recess of the transparent substrate 200, the thickness of a sealing resin 211 for covering the light emitting diode 204 can be reduced. <P>COPYRIGHT: (C)2004,JPO |
