Wafer back side coating to balance stress from passivation layer on front of wafer and be used as a die attach adhesive

摘要

A method and apparatus for balancing layer-caused compressive or tensile stress in a semiconductor die, die wafer or similar substrate uses a stress-balancing layer (SBL) attached to the opposite side from the stress-causing layer before the die or wafer is significantly warped. The SBL may also serve as, or support, an adhesive layer for die attach and be of a markable material for an enhanced marking method.