发明名称 Method for fabricating semiconductor film and semiconductor device and laser processing apparatus
摘要 A technique to control segregation of impurities when reforming crystallinity and crystallization of a semiconductor film by using a laser beam irradiation is provided. The present invention is to irradiate the substrate with applying ultrasonic vibration while keeping the end portion of the substrate in space. The substrate on which a semiconductor film is formed is kept onto the stage provided with opening pores, and floated by spouting gas from opening pores. Supersonic vibration can be efficiently provided to the substrate by irradiating with a laser beam with ultrasonic vibration while keeping the end portion of the substrate.
申请公布号 US2004106242(A1) 申请公布日期 2004.06.03
申请号 US20030706978 申请日期 2003.11.14
申请人 SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 ARAO TATSUYA;YAMAZAKI SHUNPEI
分类号 B23K26/073;B23K26/08;H01L21/00;H01L21/20;(IPC1-7):H01L21/00 主分类号 B23K26/073
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