发明名称 Plating a conductive material on a dielectric material
摘要 A surface may be selectively coated with a polymer using an induced surface grafting or polymerization reaction. The reaction proceeds in those regions that are polymerizable and not in other regions. Thus, a semiconductor structure having organic regions and metal regions exposed, for example, may have the organic polymers formed selectively on the organic regions and not on the unpolymerizable or metal regions.
申请公布号 US2004104483(A1) 申请公布日期 2004.06.03
申请号 US20030722800 申请日期 2003.11.26
申请人 GOODNER MICHAEL D.;KLOSTER GRANT;JOHNSTON STEVEN W. 发明人 GOODNER MICHAEL D.;KLOSTER GRANT;JOHNSTON STEVEN W.
分类号 H01L21/288;H01L21/312;H01L21/3205;H01L21/768;(IPC1-7):H01L23/48;H01L23/52;H01L29/40 主分类号 H01L21/288
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