发明名称 |
Plating a conductive material on a dielectric material |
摘要 |
A surface may be selectively coated with a polymer using an induced surface grafting or polymerization reaction. The reaction proceeds in those regions that are polymerizable and not in other regions. Thus, a semiconductor structure having organic regions and metal regions exposed, for example, may have the organic polymers formed selectively on the organic regions and not on the unpolymerizable or metal regions. |
申请公布号 |
US2004104483(A1) |
申请公布日期 |
2004.06.03 |
申请号 |
US20030722800 |
申请日期 |
2003.11.26 |
申请人 |
GOODNER MICHAEL D.;KLOSTER GRANT;JOHNSTON STEVEN W. |
发明人 |
GOODNER MICHAEL D.;KLOSTER GRANT;JOHNSTON STEVEN W. |
分类号 |
H01L21/288;H01L21/312;H01L21/3205;H01L21/768;(IPC1-7):H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L21/288 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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