| 摘要 |
PROBLEM TO BE SOLVED: To provide a sealing resin composition which especially has excellent crack resistance and excellent moisture-resistant reliability under high temperature on surface mounting, and to provide a semiconductor-sealed device sealed with the sealing resin composition. SOLUTION: This sealing resin composition is characterized by comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) an inorganic filler having an average particle diameter of≤15μm and containing particles having particle diameters of 1 to 10μm in an amount of≥30 wt. %, (D) a curing accelerator, and (E) a solid coupling agent comprising an imidazole compound carboxylic acid adduct represented by the formula [-C<SB>n</SB>H<SB>2n</SB>- is an alkylene; (n) is≥1] as essential components, wherein the inorganic filler (C) is contained in an amount of 25 to 95 wt. % based on the resin composition. This semiconductor-sealed device is characterized by sealing a semiconductor chip with the cured product of the sealing resin composition. COPYRIGHT: (C)2004,JPO |
