| 摘要 |
PROBLEM TO BE SOLVED: To reduce electric connection failure between conductive layers generated due to the thermal expansion difference of an insulating layer and a conductor layer in the via hole of a printed wiring board. SOLUTION: In this printed wiring board, the area of a joint face 18 of a first conductor 12 and a second conductor 15 at a via bottom part, and the second conductor 15 is provided with a fringe(collar) area 21 connected to a surface 17 of the second insulating layer at an outer peripheral part 20 of the opening of the second insulating layer 14 at the via bottom part. Therefore, the printed wiring board can be stabilized against a tensile stress generated due to the thermal expansion difference of the insulating layer and the conductor layer, and any electric connection failure between the conductor layers in the via can be prevented from being generated. COPYRIGHT: (C)2004,JPO |
