| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus wherein first the turbulent flow or the stagnation of liquid is prevented and treatment is unified without dispersion, whereby the accuracy of a printed wiring substrate is improved, while secondly the generation of a trouble of a circuit such as damage or the like is prevented and a defective in the printed wiring substrate is reduced, whereby an yield is improved. SOLUTION: The substrate treatment device 5 is employed in the manufacturing process of the printed wiring substrate. In this case, treatment liquid S is injected from spray nozzles 4, and regulating liquid E is sprayed from fore-and-rear regulating liquid spraying units 6 while transferring the printed wiring substrate P by a conveyer 2 in a no contact state with the front surface Q or the rear surface F of a circuit forming surface R. According to this method, regulating liquid zones are formed on the circuit forming surface R along the direction of left-and-right width W, and the treatment liquid S is regulated while being pinched between the regulating liquid zones, whereby the liquid effects predetermined treatment during flowing in forming a flow passage along the direction of left-and-right width W, and thereafter, the liquid flows down from both right and left sides of the circuit-forming apparatus. COPYRIGHT: (C)2004,JPO
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