| 摘要 |
PROBLEM TO BE SOLVED: To provide a nozzle for a solder sucking device which can prevent corrosion of a solder sucking path and solve solder clogging and has excellent heat conductivity. SOLUTION: The nozzle of the solder sucking device has the solder sucking path 71 at a leading end and is heated to melt the solder and further to suck the molten solder through the solder sucking path. An inner surface of the solder sucking path is formed of a material 32 which is not wet with the solder but an outer surface of the leading end is formed with a material 33 which is wet with the solder. One of Al, Al alloy, stainless steel, Ti, and carbon fiber is adopted as a raw material 32 which is not wet with the solder, and one of Fe plating, Ni plating, and Fe-Ni alloy plating is adopted as a raw material 33 which is wet with the solder. COPYRIGHT: (C)2004,JPO
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