发明名称 |
Polishing method and electropolishing apparatus |
摘要 |
A polishing method for electropolishing a metal film formed on a wafer surface so as to fill concave portions formed on the wafer surface comprises a step of determining an electropolishing end point of the metal film on the basis of a change of a current waveform resulting from electropolishing the metal film. An electropolishing apparatus comprising a current detector for detecting a current waveform resulting from electropolishing a metal film and an end point determination part for determining an electropolishing end point of the metal film on the basis of the change of a current detected with the current detector is used to realize the polishing method. |
申请公布号 |
US2004104128(A1) |
申请公布日期 |
2004.06.03 |
申请号 |
US20030694263 |
申请日期 |
2003.10.27 |
申请人 |
SATO SHUZO;NOGAMI TAKESHI;YASUDA ZENYA;ISHIHARA MASAO |
发明人 |
SATO SHUZO;NOGAMI TAKESHI;YASUDA ZENYA;ISHIHARA MASAO |
分类号 |
B24B1/00;B23H3/00;B23H5/08;B24B37/00;B24B37/013;B24B37/04;B24B49/04;B24B49/10;C25F3/16;H01L21/304;H01L21/3063;H01L21/321;H01L21/768;(IPC1-7):C25D17/00 |
主分类号 |
B24B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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