| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a bump structure capable of securing highly reliable connection at the time of connecting a semiconductor chip to a wiring board by using a peel transfer method. <P>SOLUTION: In this connection structure, a semiconductor chip (11) and a wiring substrate (21) are arranged so as to be faced to each other to connect a bump formed on a semiconductor chip (11) to a bump formed on the wiring board (21). The bump (14) formed on the semiconductor chip (11) is formed as a cross-sectional projecting bump by field-free plating, a bump (25) formed on the wiring board (21) is formed as a cross-sectional recessed bump by field-free plating, and the semiconductor chip (11) is connected to the wiring board (21) so that the projecting part of the bump (14) can be fit into the recessed part of the bump (25). <P>COPYRIGHT: (C)2004,JPO |
