| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a solder and solder ball for connection of lead-free electronic device and the electronic device using it, which can suppress growth of an intermetallic compound formed in the boundary between a package metallized with a soldering material and Cu and a terminal surface on a printed circuit board, and can solve the problem of a defect caused by the boundary fracture related to the impact resistance property. <P>SOLUTION: The solder for the connection of the electronic device is mainly composed of Sn and contains Ag of 5.0 mass%, Cu of 1.0 mass%, and trace elements of 0.008-0.10 mass% of at least 1 kind among P, Sb and Bi. Furthermore, at least one of those two relationships is satisfied that the ratio of the trace elements to Ag is 0.002-0.05 and that the ratio of the trace elements to Cu is 0.01-0.35. <P>COPYRIGHT: (C)2004,JPO</p> |
