| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor chip which is hardly to cause the misregistration of a semiconductor wafer in dicing or the generation of cracks and chippings of the semiconductor chip, when the semiconductor chip is peeled off after dicing. SOLUTION: In the manufacturing method of a semiconductor chip, a dicing adhesive tape 2 having a first region 3A whose adhesion is relatively high and a second region 3B whose adhesion is relatively low, or not having an adhesion in a part 3 wherein one semiconductor chip obtained by dicing a semiconductor wafer 1 is stuck, is used as a dicing adhesive tape 2 when the dicing adhesive tape 2 is stuck to the semiconductor wafer 1. The semiconductor wafer 1 stuck to the dicing adhesive tape 2 is diced and divided into each semiconductor chip 1A, and the semiconductor chip 1A is peeled off from the dicing adhesive tape 2. COPYRIGHT: (C)2004,JPO |
