| 摘要 |
PROBLEM TO BE SOLVED: To appropriately keep interlayer continuity and improve the reliability of a product. SOLUTION: In serial steps of manufacturing a multilayer printed circuit board 10 after a conductor foil 2 is formed on the surface of a substrate 1, the substrate on which the conductor foil 2 is formed is heated and pressurized. The conductor foil 2 formed on the surface of the substrate 1 can be buried in the substrate 1, so that the flowing out or deformation of a thermoplastic resin can be suppressed when the substrates 1, 7 and 8 are pressurized in a multilayer manner at the same time. COPYRIGHT: (C)2004,JPO |
