PROCESS FOR DEPOSITING METALLIC LAYER ON SURFACE OF SEMICONDUCTOR SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a process for forming a metallic thin film on the surface of a substrate wherein a chemical adsorption layer excellent in shape followability is obtained. SOLUTION: The process for forming the metallic layer on the surface of the substrate comprises a step wherein a metal halide layer is formed from a halogen-containing precursor and a metal-containing precursor on at least part of the surface and a step wherein the metal halide layer is exposed to a reducing agent to yield the metallic layer. COPYRIGHT: (C)2004,JPO