发明名称 POLYMER COMPOUND FOR PHOTORESIST AND RESIN COMPOSITION FOR PHOTORESIST
摘要 <P>PROBLEM TO BE SOLVED: To obtain a polymer compound for a photoresist which has not only adhesivity to a substrate, acid elimination properties and dry etching resistance but also excellent balance between solubility in a resist solvent and alkali solubility. <P>SOLUTION: The polymer compound for a photoresist comprises a monomer unit having a 2,6-dioxabicyclo[3.3.0]octane skeleton in the polymer structure. A monomer unit represented by formula (1) (R is a hydrogen atom or a methyl group) is contained in the monomer unit having the 2,6-dioxabicyclo[3.3.0]octane skeleton. The polymer compound for a photoresist may comprise the monomer unit having the 2,6-dioxabicyclo[3.3.0]octane skeleton, a monomer unit having adhesivity to a substrate and a monomer unit having an acid elimination group. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2004155874(A) 申请公布日期 2004.06.03
申请号 JP20020321755 申请日期 2002.11.05
申请人 DAICEL CHEM IND LTD 发明人 NISHIMURA MASAMICHI;KOYAMA YUTAKA;TSUTSUMI KIYOHARU
分类号 C08F20/28;C08F220/28;G03C1/76;G03F7/039;G03F7/085;H01L21/027 主分类号 C08F20/28
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