| 摘要 |
PROBLEM TO BE SOLVED: To provide a memory module that is user-friendly and also allows an increase in a memory capacity per unit volume and high-density mounting. SOLUTION: The backsides of two memory chips, each memory-accessed in units of 2 bits, are superposed one over another to form an assembly in a laminated structure to enable memory-access in units of 4 bits. The memory module is constructed by mounting a plurality of semiconductor memory devices on a mounting substrate that is square-shaped and provided with electrodes arranged along one of the sides of the mounting substrate, wherein each of the semiconductor memory devices is made up such that the backsides of two memory chips, each memory-accessed in units of 2 bits, are superposed one over another to form an assembly in a laminated structure enabling memory-access in units of 4 bits, as described above. COPYRIGHT: (C)2004,JPO
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