发明名称 HEATING AND COOLING SYSTEM FOR MOLD
摘要 PROBLEM TO BE SOLVED: To provide a heating and cooling system for a mold capable of shortening the temperature rising time of the mold. SOLUTION: In the heating and cooling system for the mold, two kinds of heating and cooling media having different temperatures are changed over to be sent to the medium passage in the mold 100 to repeat the heating process, molding process and cooling process of the mold 100. In the heating process, the changeover of a vlave for sending the heating medium to the medium passage in the mold 100 and the changeover of the cooling medium for sending the cooling medium to a circulating passage without passing the same through the mold 100 are provided. In the cooling process, a changeover valve unit 50, which performs changeover for passing the cooling medium through the mold 100 from a cooling unit 30 to circulate the same to the cooling unit, is provided. At the time of the heating process, the heating medium flowing out of the mold 100 is allowed to flow in a valve 75 having the Venturi mechanism provided to the circulating passage of the cooling medium and the heating medium is discharged by utilizing the sucking action of the Venturi mechanism of the valve 75. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004155099(A) 申请公布日期 2004.06.03
申请号 JP20020323920 申请日期 2002.11.07
申请人 SHISUKO:KK 发明人 SHIMODA TOSHIO
分类号 B29C33/04;(IPC1-7):B29C33/04 主分类号 B29C33/04
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