发明名称 SEMICONDUCTOR DEVICE HAVING ELEVATED DEVICE ISOLATION STRUCTURE AND PRODUCTION METHOD THEREFOR
摘要 <p>A semiconductor device using an SOI substrate having an elevated device isolation structure, comprising a bird's beak unit, where the thickness of a gate insulation film is gradually increases from a device center side toward a device isolation end, disposed at the end in contact with a device isolation area on a section being orthogonal to a channel current direction and including the gate electrode. The semiconductor device is excellent in characteristics such as resistance against antenna damage subjected to in the post-process, gate leak current, TDDB characteristics, and Vth (threshold voltage) controllability by Vsub (substrate potential).</p>
申请公布号 WO2004047164(A1) 申请公布日期 2004.06.03
申请号 WO2003JP14524 申请日期 2003.11.14
申请人 NEC CORPORATION;WAKABAYASHI, HITOSHI;LEE, JONG-WOOK;KOH, RISHO;YAMAGAMI, SHIGEHARU;SAITO, YUKISHIGE 发明人 WAKABAYASHI, HITOSHI;LEE, JONG-WOOK;KOH, RISHO;YAMAGAMI, SHIGEHARU;SAITO, YUKISHIGE
分类号 H01L21/316;H01L21/336;H01L21/76;H01L21/762;H01L29/423;H01L29/49;H01L29/786;(IPC1-7):H01L21/336 主分类号 H01L21/316
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