| 摘要 |
<p>A photosensitive substrate (4) comprises a resist layer (2) formed on a wafer (3) and a gas emission preventing layer (1) formed on the resist layer (2). In order to form such a photosensitive substrate (4), firstly a resist is applied onto a wafer (3) using a resist application apparatus, and then dried to form a resist layer (2). Next, a gas emission preventing layer (1) is formed on the resist layer (2) by a sputtering method. When an exposure is carried out using a photosensitive substrate (4) having such a gas emission preventing layer (1), emission of a gas from the resist layer (2) can be effectively suppressed. Consequently, a carbon layer is not formed on surfaces of optical system components such as a multilayer-film reflection mirror even when the exposure is carried out for a long time, and thus deterioration in the reflectance can be prevented.</p> |
