| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To ensure reliable pressure contact among a plurality of semiconductor elements and among a plurality of rectifier elements being stacked, and to enhance heat dissipation through a compact arrangement. <P>SOLUTION: The pressure contact semiconductor device 10 comprises first and second cooling mechanisms 22 and 24 disposed at the opposite ends in the stacking direction of stacked semiconductor elements 14a-14c and stacked rectifier elements 18a-18c and cooling the stacked semiconductor elements 14a-14c and stacked rectifier elements 18a-18c through cooling medium, and a pressure mechanism 26 stacked on the first cooling mechanism 22 and imparting a load uniformly to the stacked semiconductor elements 14a-14c and stacked rectifier elements 18a-18c in the stacking direction. <P>COPYRIGHT: (C)2004,JPO</p> |
