| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for improving the surface quality of substrates and confronting members before their bonding, which is effective in mass production of microchips. SOLUTION: In the process for manufacturing microchips, which have a running route structure composed of a channel and a port, the bonding of substrates and confronting members is carried out after improving the surface quality through the radiation of plasma or UV light onto the bonding surfaces of the substrates or the bonding surfaces of both the substrates and the confronting members under an atmospheric pressure. COPYRIGHT: (C)2004,JPO
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