| 摘要 |
<p>PURPOSE: A chip stack package using an insulation wire is provided to be capable of improving working efficiency and preventing the electrical contact between wires, or the wire and a semiconductor chip. CONSTITUTION: A chip stack package is provided with a board(31) having a circuit pattern(32), a bottom chip(34) attached on the board by using the first adhesive(33), the first insulation wire(37) for electrically connecting the bonding pad(34a) of the bottom chip with the circuit pattern of the board, and a top chip(36) attached on the bottom chip by using the second adhesive(35). The chip stack package further includes the second insulation wire for electrically connecting the bonding pad(36a) of the top chip with the circuit pattern of the board, an encapsulating part(38) for selectively enclosing the resultant structure, and a plurality of solder balls(39) attached on the lower surface of the board for being electrically connected with the outer circuit.</p> |
