发明名称 |
Method of formation of a NiP resistance layer by electroplating |
摘要 |
A plating bath, able to form a resistance layer with a uniform thickness distribution on the roughened surface of a conductive base, including nickel ions and sulfamic acid or its salt as essential components and at least one of phosphoric acid, phosphorous acid, hypophosphorous acid, and salts of the same; a conductive base having a thin resistance layer with a stable resistance, and a resistance circuit board material using the same. |
申请公布号 |
EP1424407(A1) |
申请公布日期 |
2004.06.02 |
申请号 |
EP20030027308 |
申请日期 |
2003.11.26 |
申请人 |
FURUKAWA CIRCUIT FOIL CO., LTD. |
发明人 |
MATSUDA, AKIRA;SUZUKI, YUUJI;OTSUKA, HIDEO;KIKUCHI, YUUKI;MATSUMOTO, SADAO |
分类号 |
C25D3/12;C25D3/56;C25D5/02;C25D7/00;C25D7/06;H05K1/16;(IPC1-7):C25D3/12 |
主分类号 |
C25D3/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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