发明名称 |
METHOD OF MANUFACTURING A LIQUID DROP DISCHARGE HEAD |
摘要 |
A liquid drop discharge head includes a chip 21 that is formed by separation of a silicon wafer 20. The silicon wafer 20 has a first direction and a second direction which are mutually intersected. The chip 21 is separated from the silicon wafer 20 by etching the wafer along a separation line 22 parallel to the first direction of the wafer and by dicing the wafer 20 along a separation line 23 parallel to the second direction of the wafer. |
申请公布号 |
EP1423282(A1) |
申请公布日期 |
2004.06.02 |
申请号 |
EP20020763012 |
申请日期 |
2002.09.04 |
申请人 |
RICOH COMPANY, LTD. |
发明人 |
HASHIMOTO, KENICHIROH;MIMURA, TADASHI |
分类号 |
B41J2/14;B41J2/16;(IPC1-7):B41J2/16;B81C1/00 |
主分类号 |
B41J2/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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