LOW TEMPERATURE CO-FIRED CERAMIC MULTI SUBSTRATE ENHANCING FORCE OF SOLDERING

摘要

PURPOSE: A low temperature co-fired ceramic multi substrate enhancing a force of soldering is provided to enhance an adhesion force by enlarging a soldering region when mounting elements. CONSTITUTION: A low temperature co-fired ceramic multi substrate enhancing a force of soldering comprises a bottom external terminal(110), a lateral external terminal(120), and a solder. The bottom external terminal is connected to a part of a pattern layer(102), exchanges signals with the outside, and is formed on the most bottom ceramic substrate among a plurality of ceramic substrates to fix the ceramic substrates at mounting location. The lateral external terminal is formed on the side of the ceramic substrates and is electrically separated from the pattern layer. The solder is formed on the mounting location of the ceramic substrates and the lateral external terminal and fixes the ceramic substrates at the mounting location.