发明名称 |
AQUEOUS RESIN DISPERSION COMPOSITION |
摘要 |
<p>The present invention provides a resin aqueous dispersion composition comprising one or at least two resin particles and water, wherein when supposing that a primary average particle of each resin particle is substituted with a sphere having the same volume, a nonionic surfactant is present in an amount which occupies 75 to 95 % of the theoretical void among resin particles of 26 % when each resin particle is arranged in a close packed structure and the nonionic surfactant is a solvent which is substantially nonvolatile in a temperature range of up to 100 DEG C and evaporates or thermally decomposes at a temperature lower than the thermal decomposition temperature of the resin particles. The resin aqueous dispersion composition can be coated thickly and can prevent development of mud crack.</p> |
申请公布号 |
EP1424366(A1) |
申请公布日期 |
2004.06.02 |
申请号 |
EP20020746079 |
申请日期 |
2002.07.16 |
申请人 |
DAIKIN INDUSTRIES, LTD. |
发明人 |
SODA, YOSHIHIRO;TOMIHASHI, NOBUYUKI;MOMOSE, HIROMICHI;OGITA, KOICHIRO |
分类号 |
C08L101/00;C08K3/00;C08K5/06;C08L27/18;C08L33/08;C08L71/02;(IPC1-7):C08L101/00 |
主分类号 |
C08L101/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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