发明名称 |
Thermally developable materials containing backside conductive layer |
摘要 |
Thermally developable materials that comprise a support have at least two backside layers. One of these layers can be a protective layer comprising a film-forming polymer. The materials also includes a non-imaging backside conductive layer comprising non-acicular metal antimonate particles in a mixture of two or more polymers that includes a first polymer serving to promote adhesion of the backside conductive layer directly to the support or other layers, and a second polymer that is different than and forms a single phase mixture with the first polymer.
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申请公布号 |
EP1424593(A2) |
申请公布日期 |
2004.06.02 |
申请号 |
EP20030078608 |
申请日期 |
2003.11.13 |
申请人 |
EASTMAN KODAK COMPANY |
发明人 |
LABELLE, GARY E.;SAKIZADEH, KUMARS;LUDEMANN, THOMAS J.;BHAVE, APARNA V.;PHAM, OANH V. |
分类号 |
B41M5/323;G03C1/498;G03C1/76;G03C1/85;G03C5/02;(IPC1-7):G03C1/498;B41M5/40;B41M5/32 |
主分类号 |
B41M5/323 |
代理机构 |
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代理人 |
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地址 |
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