Power semiconductor module

摘要

A method for encapsulating a semiconductor module has the module (4) mounted on a support base (2) via an insulating layer (5) and using a thermoplastic adhesive to mould the housing (1) and encapsulate the module. Some circuit boards etc. (7) are also bonded into the housing as are the electrical connections. The housing and encapsulation are pour moulded at between 150 and 220 deg. C. and at much lower pressures than by injection moulding.