WIRE BONDING METHOD CONNECTING THE FIRST BONDING POINT TO THE SECOND BONDING POINT THROUGH A WIRE, A WIRE BONDING APPARATUS THEREOF, A WIRE LOOP HAVING REGULAR SHAPE, AND A SEMICONDUCTOR DEVICE HAVING THE WIRE LOOP

摘要

PURPOSE: A wire bonding method connecting the first bonding point to the second bonding point through a wire, a wire bonding apparatus thereof, a wire loop having regular shape, and a semiconductor device having the wire loop are provided to prevent breaking of wire loops by absorbing shocks from outside. CONSTITUTION: A wire loop includes a wire(3), a main portion(L,S), and a push portion(3c). The wire couples the first bonding point(A) and the second bonding point(Z). The wire includes a ball(30), a neck(H) and a main portion(L,S). The ball is bonded to the first bonding point. The neck is adjacent to the ball. The main portion extends from the neck portion to the second bonding point(Z). The main portion includes push portion(3c) by pressing a portion of the wire with an upper portion of the ball. The push portion is adjacent to the neck. The neck includes the first twisted portion by overlapping part of it.