发明名称 FLUID DELIVERING SYSTEM AND METHOD, AND CHEMICAL MECHANICAL POLISHING SYSTEM
摘要 PURPOSE: A fluid delivering system and method, and a CMP(Chemical Mechanical Polishing) system are provided to be capable of supplying slurry and a slurry additive to a platen as much as an aiming flow rate. CONSTITUTION: A fluid delivering system is provided with the first flow controller(14) having the first fluid input connected to the first fluid source, the second flow controller(18) having the second fluid input connected to the second fluid source, a controller(22) for controlling the flow rate of the first and second flow controller by generating an output signal, and a variable resistor(30) between the output of the controller and the input of the second flow controller. At this time, the output signal of the controller and the resistance of the variable resistor are controlled for deciding the flow rate of fluid from the first and second flow controller.
申请公布号 KR20040045262(A) 申请公布日期 2004.06.01
申请号 KR20030010465 申请日期 2003.02.19
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 ALI, AHMED;GARELQ, MICHELLE;LUJAN, RANDALL;TUCKER, JOSH
分类号 H01L21/304;B24B49/00;B24B57/02;(IPC1-7):H01L21/304 主分类号 H01L21/304
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