| 摘要 |
A multichip semiconductor package device includes first and second devices and a conductive bond. The first device includes an insulative housing, a first semiconductor chip and a conductive trace. The first insulative housing includes a peripheral ledge and a central portion that is recessed relative to the peripheral ledge, and the peripheral ledge and the central portion form a cavity. The conductive trace includes a terminal that extends through the central portion and a lead that protrudes laterally from and extends through the side surface. The second device includes a second semiconductor chip, extends into the cavity and is positioned within and does not extend outside a periphery of the cavity. The conductive bond is inside the cavity, on the terminal and contacts and electrically connects the first and second devices.
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