发明名称 |
Method for partially plating on a base |
摘要 |
A base of synthetic resins or other materials is partially plated. The base includes not only a single base but an assembly with a number of chip bases for producing electronic and electric parts such as printed circuit board, lead frame insert molded circuit parts, etc. A method for partially plating a base by the use of a plating catalyst includes a coating process to coat a surface to be plated or not to be plated by means of a coating material selected from a water soluble polymer or hydrolyzable polymer either before or after a catalyst applying process to soak a container containing the base in a plating catalyst bath.
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申请公布号 |
US6743477(B2) |
申请公布日期 |
2004.06.01 |
申请号 |
US20000735931 |
申请日期 |
2000.12.14 |
申请人 |
SUMITOMO SHOJI PLASTICS CO., LTD. |
发明人 |
ITOH RYOH |
分类号 |
H05K1/00;C23C18/16;H05K3/00;H05K3/06;H05K3/18;(IPC1-7):B05D5/12 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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