发明名称 Method for partially plating on a base
摘要 A base of synthetic resins or other materials is partially plated. The base includes not only a single base but an assembly with a number of chip bases for producing electronic and electric parts such as printed circuit board, lead frame insert molded circuit parts, etc. A method for partially plating a base by the use of a plating catalyst includes a coating process to coat a surface to be plated or not to be plated by means of a coating material selected from a water soluble polymer or hydrolyzable polymer either before or after a catalyst applying process to soak a container containing the base in a plating catalyst bath.
申请公布号 US6743477(B2) 申请公布日期 2004.06.01
申请号 US20000735931 申请日期 2000.12.14
申请人 SUMITOMO SHOJI PLASTICS CO., LTD. 发明人 ITOH RYOH
分类号 H05K1/00;C23C18/16;H05K3/00;H05K3/06;H05K3/18;(IPC1-7):B05D5/12 主分类号 H05K1/00
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