发明名称 |
Solder ball disposing apparatus, solder ball reflow apparatus, and solder ball bonding apparatus |
摘要 |
An apparatus joins bonding pads of a slider and lead pads of lead wires in a head gimbals assembly to improve efficiency, downsizing, and maintenance of solder-ball disposing devices, and solder-ball reflow devices for reflowing solder balls. The solder-ball disposing apparatus discharges solder balls from solder-ball discharging holes of a solder-ball feeder unit which are evacuated by a suction pad. An environmental space and an inert-gas supply portion for forming inactive atmosphere are formed on a table to eliminate an inert-gas supply unit from an optical unit, so that converged laser beams are directly radiated onto the solder balls.
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申请公布号 |
US6742694(B2) |
申请公布日期 |
2004.06.01 |
申请号 |
US20020074718 |
申请日期 |
2002.02.13 |
申请人 |
HITACHI GLOBAL STORAGE TECHNOLOGIES NETHERLANDS B.V. |
发明人 |
SATOH TAKUYA;TSUCHIYA TATSUMI;MITA YASUHIRO;SHI LAN;YOKOME HIROYOSHI;YOSHIDA TATSUSHI;PATTANAIK SURYA |
分类号 |
G11B5/60;B23K1/005;B23K3/06;B23K3/08;G11B5/48;G11B21/21;H05K3/34;(IPC1-7):B23K1/00;B23K5/00;B23K20/14;B23K37/00 |
主分类号 |
G11B5/60 |
代理机构 |
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代理人 |
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