Epoxy hardener of imidazole or trihydric compound with methylol groups, trimethylolpropane and tetramethylguanidine (adduct)

摘要

An epoxy resin hardener having a cure temperature of between about 60° C. and 100° C. comprises a mixture of:a) an imidazole or a trihydric compound having methylol groups at the 2- and 6-positions formed by reacting a 4-alkylphenol with 2 moles of formaldehyde,b) trimethylopropane, andc) tetramethylguanidine or a tetramethylguanidine derived from the reaction of a monepoxide, a diepoxide, a phenol and formaldehyde, or a dihydric phenol and formaldehyde.