发明名称 Method of improving surface planarity prior to MRAM bit material deposition
摘要 The present invention provides a method of fabricating a portion of a memory cell, the method comprising providing a first conductor in a trench which is provided in an insulating layer and flattening an upper surface of the insulating layer and the first conductor, forming a material layer over the flattened upper surface of the insulating layer and the first conductor and flattening an upper portion of the material layer while leaving intact a lower portion of the material layer over the insulating layer and the first conductor.
申请公布号 US6743641(B2) 申请公布日期 2004.06.01
申请号 US20010022721 申请日期 2001.12.20
申请人 MICRON TECHNOLOGY, INC. 发明人 YATES DONALD L.;DREWES JOEL A.
分类号 H01L21/3205;G11C11/00;G11C11/15;H01L21/768;H01L21/8246;H01L27/105;H01L27/22;H01L43/08;(IPC1-7):H01L21/00 主分类号 H01L21/3205
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